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Material Control
Bonding Technology
Bondability tests on bonding wires and substrates
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Gas Analysis
Precise determination of traces of H, C, N, O and S in the bulk by hot extraction
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Metallography
Microhardness and low-load hardness tests
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Surface analysis
REM, EDX, WDX, AES, SIMS, XPS
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Melting and heat treatment Technology
Manufacture of high purity metals and alloys by melting and sintering
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