SMT/HYBRID/PACKAGING 2009
Europe’s largest specialist fair for system integration in the microelectronics branch!
From May 5th to May 7th the SMT/Hybrid/Packaging will be held at the Nuremberg Exhibition Centre. On show, amongst many other things, will be all the latest trends and developments from the world of electronics.
The focal point of the 2009 congress will be the topic “Producing electronic components on a flexible and flex-rigid basis”.
Divisions participating
- Contact Materials Division
Business Unit Assembly Materials
Business Unit Bonding Wires - Thick Film Materials Division
Business Unit Thick Film - Engineered Materials Division
Business Unit Precision Technology
We would be pleased to greet you in Hall 9, at booth 537.
Heraeus Trade Fair Highlights
- European premiere: Rel-k Gold Bonding Wire
- Technical presentation: Bonding with aluminum wire and tape in the field of power and solar electronics: Applications and quality improvement.
- Mr. Jürgen Dick, W. C. Heraeus GmbH
